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US 2011/0298124 A1Published application
Semiconductor Structure
AssigneeChipMOS Technologies Inc.
InventorGeng-Shin Shen
Life of this patent
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Abstract
A semiconductor structure is provided. By using a composite bump with replace of a gold bump, the consumption of gold can be reduced and the manufacturing cost can be decreased accordingly. Moreover, by using an encapsulation material formed on a metal layer, the heat transferring efficiency of the semiconductor structure can be improved and the stability thereof can be increased.
Claims14
A semiconductor structure, comprising:
- a substrate having a package array, wherein the package array has a plurality of contact pads and a protection layer, and the plurality of the contact pads are exposed to the outer side of the protection layer and arranged in array;
- a non-conductive layer covering the substrate and the package array, having a plurality of openings to expose the contact pads;
- a plurality of chips, adhering to the package array of the substrate by the non-conductive layer, wherein each of the chips comprises an active surface, a plurality of chip pads and a plurality of composite bumps, the chip pads are formed on the active surface, the composite bumps are formed on the contact pads, and each of the composite bumps electrically connects to each of the chip pads corresponding to each of the openings;
- an encapsulant covering the chips on the substrate;
- and
- a metal layer disposed on the encapsulant of the chips.
3 more elements
Dependencies are inferred from the claim text.