Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

A method of forming package assemblies, the method comprising:

• providing a substrate comprising at least a layer of semiconductor material having a plurality of optically interactive devices on a surface thereof, wherein each optically interactive device comprises an image sensitive area and at least one conductive via extending from the surface of the substrate to another, opposing surface of the substrate;
• bonding a transparent cover to the surface of the substrate over the plurality of optically interactive devices;
• forming a conductive bump over the at least one conductive via of each optically interactive device on the another, opposing surface of the substrate;
• and
• cutting the substrate and the transparent cover to mutually separate the plurality of optically interactive devices;
• attaching at least some of the plurality of optically interactive devices to a surface of an interposer by bonding the conductive bump over the at least one conductive via of each optically interactive device to an attachment pad of a plurality of attachment pads on the surface of the interposer.

A method of forming package assemblies, the method comprising:

• providing a substrate comprising at least a layer of semiconductor material having a plurality of optically interactive devices on a surface thereof, wherein each optically interactive device comprises an image sensitive area and at least one bond pad outside a peripheral edge of the image sensitive area;
• cutting the substrate to mutually separate the plurality of optically interactive devices;
• attaching at least some of the plurality of optically interactive devices to a surface of an interposer;
• forming a wire bond extending from the at least one bond pad of each optically interactive device to at least one attachment pad of a plurality of attachment pads on the surface of the interposer;
• and
• bonding a transparent cover to each optically interactive device with an adhesive material surrounding a peripheral edge of the image sensitive area of each optically interactive device and covering the at least one bond pad of each optically interactive device.

A method of forming package assemblies, the method comprising:

• providing a substrate comprising at least a layer of semiconductor material having a plurality of optically interactive devices on a surface thereof, wherein each optically interactive device comprises an image sensitive area;
• bonding a transparent cover to the front surface of the substrate over the plurality of optically interactive devices;
• sectioning the transparent cover outside the peripheral edge of the image sensitive area of each optically interactive device to leave a portion of the transparent cover over the image sensitive area of each optically interactive device;
• cutting the substrate to mutually separate the plurality of optically interactive devices;
• attaching at least some of the plurality of optically interactive devices to a surface of an interposer;
• electrically connecting each optically interactive device to at least one conductive pathway on the interposer;
• cutting the interposer at locations between the plurality of optically interactive devices to form a plurality of individual package subassemblies;
• mounting at least one individual package subassembly of the plurality of individual package subassemblies within a cavity of a package housing;
• electrically connecting the at least one individual package subassembly to at least one conductive pathway in the cavity of the package housing;
• and
• at least partially filling the cavity of the package housing with a sealant material.

A method of forming package assemblies, the method comprising:

• providing a substrate comprising at least a layer of semiconductor material having a plurality of optically interactive devices on a surface thereof, wherein each optically interactive device comprises an image sensitive area;
• bonding a transparent cover to the surface of the substrate over the plurality of optically interactive devices;
• sectioning the transparent cover outside the peripheral edge of the image sensitive area of each optically interactive device to leave a portion of the transparent cover over the image sensitive area of each optically interactive device;
• cutting the substrate to mutually separate the plurality of optically interactive devices;
• mounting at least one optically interactive device of the plurality of optically interactive devices within a cavity of a package housing;
• electrically connecting the at least one optically interactive device to at least one conductive pathway in the cavity of the package housing;
• and
• at least partially filling the cavity of the preformed package housing with a sealant material.

An electronic device package assembly, comprising:

• an interposer having at least one conductive pathway including an attachment pad on a surface thereof;
• an optically interactive device mounted to the interposer and having a surface with an image sensitive area and at least one bond pad outside the image sensitive area;
• a transparent cover bonded over the image sensitive area to the surface of the optically interactive device between a peripheral edge of the image sensitive area and the at least one bond pad;
• an electrical connection between the at least one bond pad and the attachment pad of the at least one conductive pathway of the interposer wherein the electrical connection comprises a conductive trace extending from the at least one bond pad on the surface of the optically interactive device to another, opposing surface of the optically interactive device;
• and
• a layer of encapsulant material over the surface of the interposer partially covering the optically interactive device and leaving the transparent cover substantially exposed.

An electronic device package assembly, comprising:

• an interposer having at least one conductive pathway including an attachment pad on a surface thereof;
• an optically interactive device mounted to the interposer and having a surface with an image sensitive area, at least one conductive via extending from the surface to another, opposing surface of the optically interactive device and a conductive bump bonded between the at least one conductive via and the attachment pad;
• a transparent cover bonded to the surface of the optically interactive device over the image sensitive area and outside a peripheral edge thereof;
• and
• a layer of encapsulant material over the surface of the interposer partially covering the optically interactive device and leaving the transparent cover substantially exposed.

An electronic device package assembly, comprising:

• an interposer having at least one conductive pathway including an attachment pad on a surface thereof;
• an optically interactive device mounted to the interposer and having a surface with an image sensitive area and at least one bond pad outside the image sensitive area;
• a wire bond extending from the at least one bond pad to the attachment pad of the at least one conductive pathway of the interposer;
• a transparent cover bonded to the surface of the optically interactive device outside a peripheral edge of the image sensitive area of the optically interactive device with an adhesive covering the at least one bond pad of the optically interactive device;
• and
• a layer of encapsulant material over the surface of the interposer partially covering the optically interactive device, while leaving substantially exposed the transparent cover.

An electronic device package assembly, comprising:

• a package housing having a cavity and at least one conductive pathway including an attachment pad within the cavity;
• an interposer mounted within the cavity of the package housing having at least one conductive pathway including an attachment pad on a surface of the interposer;
• wherein the at least one conductive pathway of the interposer is electrically connected to the attachment pad within the cavity of the package housing;
• an optically interactive device having a surface with an image sensitive area mounted to the interposer and electrically connected to the attachment pad on the surface of the interposer;
• a transparent cover bonded over the image sensitive area of the optically interactive device with an adhesive material adhered to the surface of the optically interactive device outside a peripheral edge of the image sensitive area;
• and
• a sealant material at least partially filling the cavity of the package housing.

An electronic device package assembly, comprising:

• a package housing having a cavity and at least one conductive pathway including an attachment pad within the cavity;
• an optically interactive device having an image sensitive area on a surface thereof mounted within the cavity of the package housing and electrically connected to the attachment pad within the cavity;
• a transparent cover bonded over the image sensitive area of the optically interactive device with an adhesive material adhered to the surface of the optically interactive device outside a peripheral edge of the image sensitive area;
• and
• a sealant material at least partially filling the cavity of the package housing.

An electronic device package assembly, comprising:

• an interposer having at least one attachment pad on a surface thereof connected to a conductive via extending to another, opposing surface thereof;
• an optically interactive device having a surface with an image sensitive area, at least one bond pad outside the image sensitive area and a conductive via extending from the at least one bond pad to another, opposing surface of the optically interactive device;
• a conductive bump connecting the at least one attachment pad to the conductive via at the another, opposing surface of the optically interactive device;
• and
• a transparent cover bonded over the image sensitive area to the surface of the optically interactive device with an adhesive material disposed outside a peripheral edge of the image sensitive area and extending over the at least one bond pad.

An electronic device package assembly, comprising:

• an interposer having at least one attachment pad on a surface thereof connected to a conductive via extending to another, opposing surface thereof;
• an optically interactive device having a surface with an image sensitive area, at least one bond pad outside the image sensitive area and a conductive trace extending from the at least one bond pad around a side of the optically interactive device to another, opposing surface of the optically interactive device;
• a conductive bump connecting the at least one attachment pad to the conductive trace at the another, opposing surface of the optically interactive device;
• and
• a transparent cover bonded over the image sensitive area to the surface of the optically interactive device with an adhesive material disposed outside a peripheral edge of the image sensitive area and short of the at least one bond pad.

An electronic device package assembly, comprising:

• an interposer having at least one attachment pad on a surface thereof connected to a conductive via extending to another, opposing surface thereof;
• an optically interactive device mounted to the interposer and having a surface with an image sensitive area and at least one bond pad outside the image sensitive area;
• a transparent cover bonded over the image sensitive area to the surface of the optically interactive device with a frame of adhesive material extending around a peripheral edge of the image sensitive area and over the at least one bond pad;
• and
• an electrical connection between the at least one bond pad and the at least one attachment pad extending through the adhesive material.