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US 2011/0298064 A1Published application
Sensor module and method for producing sensor modules
AssigneeEpcos AG
InventorsWolfgang Pahl, Gregor Feiertag, Anton Leidl
Life of this patent
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Abstract
Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
Claims27
A sensor module, comprising
- a carrier;
- at least one sensor chip;
- and
- at least one evaluation chip electrically coupled to the sensor chip, wherein
- the carrier has a cutout,
- the sensor chip is at least partly situated in the cutout, and
- the evaluation chip is arranged on the carrier and at least partly covers the cutout.
4 more elements
A method for producing a plurality of sensor modules, comprising:
- forming a plurality of sensor modules, each by:
- electrically coupling an evaluation chip to a sensor chip;
- situating the sensor chip at least partly in a cutout of a carrier, and
- arranging the evaluation chip on the carrier such that the evaluation chip at least partly covers the cutout;
- applying a first layer over the plurality of sensor modules arranged using panel technology;
- and
- singulating the sensor modules into individual sensor modules.
4 more elements
Dependencies are inferred from the claim text.