Chip package
OwnerTsang-Yu LIU, Yu-Lin YEN +2inventors
InventorsTsang-Yu LIU, Yu-Lin YEN, Chuan-Jin SHIU, Po-Shen LIN
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Abstract
According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer.
Claims27
A chip package, comprising:
- a substrate having a first surface and a second surface;
- an optical device between the first surface and the second surface of the substrate;
- a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening;
- at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device;
- and
- a light shielding layer formed on the protection layer and extending onto a sidewall of the opening of the protection layer.
A chip package, comprising:
- a substrate having a first surface and a second surface;
- an optical device between the first surface and the second surface of the substrate;
- a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening;
- at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device;
- a light shielding layer formed on the second surface of the substrate;
- and
- at least a second light shielding layer formed on the second surface of the substrate.
A chip package, comprising:
- a substrate having a first surface and a second surface;
- a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening;
- at least a conducting bump formed in the opening of the protection layer;
- and
- an insulating smooth layer formed between the conducting bump and a sidewall of the opening.
Dependencies are inferred from the claim text.