Semiconductor light emitting device and method for manufacturing same
AssigneeKabushiki Kaisha Toshiba
InventorsHideo NISHIUCHI, Kazuhito Higuchi, Susumu Obata, Toshiya Nakayama
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AssigneeKabushiki Kaisha Toshiba
InventorsHideo NISHIUCHI, Kazuhito Higuchi, Susumu Obata, Toshiya Nakayama
Estimating the term…
According to one embodiment, a semiconductor light emitting device includes a light emitting unit, first and second conductive members, an insulating layer, a sealing member, and an optical layer. The light emitting unit includes a semiconductor stacked body and first and second electrodes. The semiconductor stacked body includes first and second semiconductor layers and a light emitting layer, and has a major surface on a second semiconductor layer side. The first and second electrodes are connected to the first and second semiconductor layers on the major surface side, respectively. The first conductive member is connected to the first electrode and includes a first columnar portion covering a portion of the second semiconductor. The insulating layer is provided between the first columnar portion and the portion of the second semiconductor. The sealing member covers side surfaces of the conductive members. The optical layer is provided on the other major surface.
A semiconductor light emitting device, comprising:
A method for manufacturing a semiconductor light emitting device, the semiconductor light emitting device including a light emitting unit, a first conductive member, an insulating layer, a second conductive member, a sealing member, and an optical layer, the light emitting unit including a semiconductor stacked body, a first electrode, and a second electrode, the semiconductor stacked body including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the semiconductor stacked body having a first major surface on a first semiconductor layer side and a second major surface on a second semiconductor layer side, the first electrode being electrically connected to the first semiconductor layer on a second major surface side, the second electrode being electrically connected to the second semiconductor layer on the second major surface side, the first conductive member being electrically connected to the first electrode, the first conductive member including a first columnar portion provided on the second major surface to cover a portion of the second semiconductor layer on the second major surface side, the first columnar portion being separate from the second semiconductor layer, the insulating layer being provided between the first columnar portion and the portion of the second semiconductor layer on the second major surface side, the second conductive member being electrically connected to the second electrode and including a second columnar portion provided on the second major surface, the sealing member covering a side surface of the first conductive member and a side surface of the second conductive member, the optical layer being provided on the first major surface of the semiconductor stacked body and including a wavelength conversion unit configured to absorb an emitted light emitted from the light emitting layer and emit light having a wavelength different from a wavelength of the emitted light, the method comprising:
Dependencies are inferred from the claim text.