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US 2011/0297979 A1Published application
Passivation for a semiconductor light emitting device
AssigneesPhilips Lumileds Lighting Company, LLC, Koninklijke Philips Electronics N.V.
InventorsFrederic S. DIANA, Henry Kwong-Hin CHOY, Qingwei MO, Serge L. RUDAZ, Frank L. WEI, Daniel A, STEIGERWALD
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Abstract
In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.
Claims20
A method comprising:
- providing a structure comprising:
- a wafer comprising a plurality of semiconductor light emitting devices, each light emitting device comprising a light emitting layer disposed between an n-type region and a p-type region;
- a passivation layer disposed on a side of at least one of the semiconductor light emitting devices;
- and
- a first material disposed on the wafer between two semiconductor light emitting devices;
- disposing a second material between the structure and a mount, wherein the first material is configured to adhere to the second material;
- and
- attaching the structure to the mount.
5 more elements
A device comprising:
- a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;
- a passivation layer disposed over at least part of a sidewall of the semiconductor structure;
- and
- a material disposed over an etched surface of the semiconductor structure, wherein the material is configured to adhere to an underfill.
1 more element
A structure comprising:
- a wafer comprising a plurality of semiconductor light emitting devices, each light emitting device comprising a light emitting layer disposed between an n-type region and a p-type region;
- a passivation layer disposed on a side of at least one of the semiconductor light emitting devices;
- and
- a material disposed on the wafer between two semiconductor light emitting devices, wherein the material is configured to adhere to an underfill.
1 more element
Dependencies are inferred from the claim text.