Compound seminconductor structure
AssigneeFujitsu Limited
InventorsToshihide Kikkawa, Kenji Imanishi
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AssigneeFujitsu Limited
InventorsToshihide Kikkawa, Kenji Imanishi
Estimating the term…
A method for manufacturing a compound semiconductor structure, includes (a) selecting a conductive SiC substrate in accordance with color and resistivity and (b) epitaxially growing a GaN series compound semiconductor layer on the selected conductive SiC substrate. The step (a) preferably selects a conductive SiC substrate whose main color is green, whose conductivity type is n-type and whose resistivity is 0.08 52 cm to 1×105 Ωcm, or whose main color is black, whose conductivity type is p-type and whose resistivity is 1×103 Ωcm to 1×105Ωcm, or whose main color is blue, whose conductivity type is p-type and whose resistivity is 10 Ωcm to 1×105 Ωcm. The step (b) preferably includes (b-1) growing an AlInGaN layer having a thickness not thinner than 10 μm on the conductive SiC substrate by hydride VPE.
A compound semiconductor structure comprising:
A compound semiconductor structure comprising:
Dependencies are inferred from the claim text.