Semiconductor Packages
AssigneeSamsung Electronics Co., Ltd.
InventorsJun-ho Jo, Byoung-sul Kim, Kwang-won Park, Hak-yong Lee
Life of this patent
Estimating the term…
Abstract
Provided are a semiconductor package, a semiconductor memory module including the semiconductor package, and a system including the semiconductor memory module. The semiconductor package may include a plurality of main terminals arranged on a surface of the semiconductor package with constant intervals, and the plurality of main terminals may include terminals of a first set including a plurality of input/output terminals to which test signals may be input, and terminals of a second set including a plurality of input/output terminals to/from which signals other than the test signals may be input/output.
Claims24
A semiconductor package comprising:
- a plurality of main terminals on a surface of the semiconductor package, the plurality of main terminals being arranged with constant intervals, wherein the plurality of main terminals includes terminals of a first set including a plurality of input/output terminals to which test signals may be input, and terminals of a second set including a plurality of input/output terminals to/from which signals other than the test signals may be input/output.
A semiconductor package comprising:
- a plurality of main terminals arranged in a pattern, the pattern having one of a square and rectangular circumference, the plurality of main terminals including terminals of a first set, the terminals of the first set being configured to receive test signals.
Dependencies are inferred from the claim text.