Non-Volatile Memory Having 3d Array of Read/Write Elements with Vertical Bit Lines and Laterally Aligned Active Elements and Methods Thereof
OwnerGeorge Samachisa, Johann Alsmeierinventors
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OwnerGeorge Samachisa, Johann Alsmeierinventors
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A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes which together with arrays of word lines on each plane are used to access the memory elements. The memory elements of the multiple layers are formed simultaneously in an orientation parallel to the substrate thereby reducing processing cost. In another aspect, a diode is formed in series with each memory element to reduce current leakage. The diode is incorporated within a pillar line acting as a bit line without taking up additional space.
A memory including memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes stacked in the z-direction over a semiconductor substrate, the memory further comprising:
A method of forming a memory having memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes stacked in the z-direction, comprising:
Dependencies are inferred from the claim text.