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AssigneeAvago Technologies ECBU IP (Singapore) Pte. Ltd.
InventorsYufeng Yao, Chi Boon Ong, Rani Saravanan
Estimating the term…
In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second transparent encapsulant, and an opaque encapsulant. The transmitter die, the receiver die and the ASIC die are attached to portions of the lead frame. Wire bonds electrically connect the transmitter die, the receiver die, the ASIC die, and the lead frame. The first transparent encapsulant covers the receiver die, the ASIC die, the wire bonds, and a portion of the lead frame. The second transparent encapsulant covers the transmitter die, the wire bonds, and a portion of the lead frame. The opaque encapsulant covers portions of the first and second encapsulants and a portion of the lead frame.
A proximity sensor package comprising:
A method of making a proximity sensor package, comprising:
An infrared proximity sensor package comprising:
Dependencies are inferred from the claim text.