Method of hydrophobizing and patterning frontside surface of integrated circuit
AssigneeSilverbrook Research Pty Ltd
InventorsGregory John McAvoy, Emma Rose Kerr, Kia Silverbrook
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AssigneeSilverbrook Research Pty Ltd
InventorsGregory John McAvoy, Emma Rose Kerr, Kia Silverbrook
Estimating the term…
A method of hydrophobizing a frontside surface of an integrated circuit. The method includes the steps of: (a) depositing a hydrophobic polymeric layer onto the frontside surface; (b) depositing a protective metal film onto the hydrophobic polymeric layer; (c) depositing a sacrificial material onto the metal film; (d) patterning the sacrificial material; (e) etching through the metal film, the hydrophobic polymeric layer and the frontside surface; (f) performing MEMS processing steps on a backside of the integrated circuit; (g) subjecting the integrated circuit to an oxidizing plasma, wherein the metal film protects the hydrophobic polymeric layer from the oxidizing plasma; and (h) removing the protective metal film to provide an integrated circuit having a relatively hydrophobic patterned frontside surface.
A method of hydrophobizing and patterning a frontside surface of an integrated circuit, said method comprising the steps of:
Dependencies are inferred from the claim text.