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US 2011/0297434 A1Published application
Vacuum hermetic organic packaging carrier
AssigneeIndustrial Technology Research Institute
InventorsLung-Tai Chen, Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan
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Abstract
A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.
Claims13
An organic packaging carrier, comprising:
- an organic substrate having a first surface;
- a conductive circuit layer, located on the first surface and exposing a portion of the first surface;
- and
- an inorganic hermetic insulation film, at least covering the exposed first surface to achieve an effect of hermetically sealing the organic packaging carrier.
1 more element
Dependencies are inferred from the claim text.