Wiring substrate and manufacturing method thereof
AssigneeShinko Electric Industriesco., Ltd.
InventorMasahiro SUNOHARA
Life of this patent
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Abstract
A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the wiring insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked without the adhesive layer interposed between the electrode layer and the wiring layer.
Claims6
A wiring substrate comprising:
- a wiring layer made of copper;
- an electrode layer made of copper;
- and
- an insulating layer arranged adjacent to the electrode layer,
- wherein the wiring layer is stacked on the electrode layer and the insulating layer,
- the insulating layer and the wiring layer are stacked with an adhesive layer interposed between the insulating layer and the wiring layer, and
- the electrode layer and the wiring layer are stacked without the adhesive layer interposed between the electrode layer and the wiring layer.
A manufacturing method of a wiring substrate, the method comprising:
- forming a sacrificial layer on a surface of an electrode layer that is made of copper and is arranged adjacent to an insulating layer;
- forming an adhesive layer on a surface of the insulating layer and on a surface of the sacrificial layer;
- removing the sacrificial layer and the adhesive layer formed on the sacrificial layer;
- and
- forming a wiring layer using copper on the surface of the electrode layer, which is exposed by removing the sacrificial layer, and on the adhesive layer.
A manufacturing method of a wiring substrate, the method comprising:
- forming an adhesive layer on a surface of an insulating layer and a surface of an electrode layer that is made of copper and is arranged adjacent to the insulating layer;
- forming a resist pattern on the adhesive layer, the resist pattern being formed with an opening hole on the electrode layer;
- removing the adhesive layer on the electrode layer using the resist pattern as a resist mask;
- and
- forming a wiring layer using copper on the surface of the electrode layer, which is exposed by removing the adhesive layer, and on the adhesive layer.
Dependencies are inferred from the claim text.