Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Hyun NOH, Dong Uk LEE, Chin Kwan KIM
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Abstract
Disclosed is a printed circuit board, including a base substrate, a first bump including a first metal layer formed on the base substrate and a second metal layer formed on the first metal layer, and a second bump including a third metal layer formed on the base substrate, in which the first bump has a height greater than that of the second bump. Because the heights of the first bump and the second bump are different, even when the printed circuit board warps, an electrical connection between the printed circuit board and an external substrate does not become broken. A method of manufacturing the printed circuit board is also provided.
Claims15
A printed circuit board, comprising:
- a base substrate;
- a first bump including a first metal layer formed on the base substrate and a second metal layer formed on the first metal layer;
- and
- a second bump including a third metal layer formed on the base substrate, wherein the first bump has a height greater than that of the second bump.
A method of manufacturing a printed circuit board, comprising:
- (A) forming a patterned first metal layer on a base substrate;
- and
- (B) simultaneously forming a second metal layer having a pattern corresponding to the first metal layer on the first metal layer and forming a patterned third metal layer on the base substrate, thus forming a first bump including the first metal layer and the second metal layer and a second bump including the third metal layer.
Dependencies are inferred from the claim text.