Heat-conducting module and heat-dissipating device having the same

Abstract

A heat-conducting module for heat conduction of an electronic heat-generating element includes a heat pipe and a vapor chamber. The vapor chamber has an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. With this arrangement, the contact area and heat-conducting efficiency between the vapor chamber and the heat pipe can be increased greatly, thereby obtaining a heat-conducting module with an excellent heat-conducting efficiency. With a heat-dissipating fin assembly and a fan being connected to the heat pipe, a heat-dissipating device having the aforesaid heat-conducting module can be obtained, whereby the heat of the vapor chamber and the heat pipe can be rapidly dissipated to the outside.

Dependencies are inferred from the claim text.