Integrated circuit and manufacturing method therefor
AssigneeNXP B.V.
InventorsMatthias Merz, Roel Daamen, Aurelie Humbert, Youri Victorovitch Ponomarev
Life of this patent
Estimating the term…
Abstract
Disclosed is an integrated circuit comprising an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode, wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound that is soluble in the liquid; the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface. An package and electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.
Claims12
An integrated circuit comprising an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode, wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound that is soluble in the liquid;
- the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface, the integrated circuit further comprising a substrate including a plurality of circuit elements and a metallization stack covering said substrate for providing interconnections between the circuit elements, wherein a metallization layer of said stack comprises at least one of the first electrode and the second electrode, said compound covering the at least one electrode region of said metallization layer.
A method of manufacturing an integrated circuit, comprising:
- forming an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode;
- and
- covering a surface of at least one of the first electrode and second electrode with a compound that is soluble in the liquid;
- the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface,
- the method further comprising:
- providing a substrate;
- forming a plurality of circuit elements on said substrate;
- forming a metallization stack covering said substrate for providing interconnections between the circuit elements,
- forming at least one of the first electrode and the second electrode in a metallization layer of said stack or on top of said metallization stack.
Dependencies are inferred from the claim text.