Substrate processing method, and program storage medium therefor
AssigneeTokyo Electron Limited
InventorsHideki NISHIMURA, Mikio Nakashima
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AssigneeTokyo Electron Limited
InventorsHideki NISHIMURA, Mikio Nakashima
Estimating the term…
A substrate processing method which can reduce the number of particles to be left on each substrate is provided. In the substrate processing method, substrates W to be processed are dried, by using a fluid heated by a heating apparatus having one or more heating mechanisms. The substrate processing method comprises a first step of supplying a mixed fluid containing a gas and a processing liquid and heated by the heating apparatus, into a processing chamber in which the substrates to be processed are placed, and a second step of supplying the heated gas into the processing chamber. The output of at least one of the heating mechanisms is kept at a preset constant value for a period of time during which a predetermined time passes after the start of the first step. In the second step, the output of the heating mechanism is determined under a feed back control.
1-5. (canceled)
A substrate processing method for drying a substrate, by using a fluid heated by a heating apparatus including an inlet, an outlet, and a plurality of heating mechanisms for heating the fluid flowing from the inlet to the outlet, the method comprising the steps of:
8-15. (canceled)
Dependencies are inferred from the claim text.