US 2011/0296679 A1Published application

Wiring board and method of manufacturing wiring board

AssigneeIbiden Co., Ltd.

InventorsMichimasa TAKAHASHI, Masakazu Aoyama

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Abstract

A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer.

Claims17

Dependent claims

A method of manufacturing a wiring board comprising:

forming a first wiring board by at least forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the base substrate opposing the first surface at least one of which is a non-pliable insulation layer, forming at least one via in at least one of the insulation layers, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate;
connecting a pliable member to the base substrate of the first wiring board;
and
connecting the pliable member to a second wiring board to thereby connect the first wiring board to the second wiring board.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 13/215,653Filed 23 Aug 2011
Priority: 17 Jul 2007
Published: 8 Dec 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification23 codes

H05K 3/4691
Composite multilayer circuits, i.e. comprising insulating layers having different properties: rigid-flexible multilayer circuits comprising rigid…
H05K 1/148
Structural association of two or more printed circuits: arrangements of two or more hingeably connected rigid printed circuit boards, i.e.…
H05K 1/0366
Consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement: reinforced, e.g. by fibres, fabrics
H05K 3/0052
Mechanical working of the substrate, e.g. drilling or punching: depaneling, i.e. dividing a panel into circuit boards; Working of the edges of…

Family

Application60/950,229Us provisional application · filed 17 Jul 2007
Application12/146,279Division · filed 25 Jun 2008
Application13/215,653Division
US 2009/0038836 A1Published application
US 8,178,789 B2Related patent
US 8,359,738 B2Related patent
US 2011/0296679 A1This patent

From the US filing history. Foreign family members aren’t listed.