Self-aligned bevels for write poles
AssigneeSeagate Technology LLC
InventorsDavid Chris Seets, Chang Xie, Christopher J. Cote, Karen Virginia Rud
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Abstract
A method of depositing material onto a base portion of a wafer is disclosed. The method includes forming a bevel into a portion of a surface of the base portion of the wafer and depositing a first layer of conductive material onto the beveled portion of the base portion so that part of the first layer includes a wedge shape above the surface of the base portion. A second layer of conductive material is deposited onto the base portion including the portion of the base portion onto which the first layer of material is deposited.
Claims20
A method, comprising:
- forming a bevel into a portion of a surface of a base portion of a wafer;
- depositing a first layer of conductive material onto the beveled portion of the base portion so that part of the first layer includes a wedge shape above the surface of the base portion;
- and
- depositing a second layer of conductive material onto the base portion including the portion of the base portion onto which the first layer of material is deposited.
A method, comprising:
- applying a first layer of a conductive material onto a base portion of a wafer so that a portion of the first layer has angled first and second opposing surfaces;
- and
- applying a second layer of the conductive material having a generally uniform thickness onto the first layer.
A method, comprising:
- forming a bevel into the surface of a base portion of a wafer;
- applying masking material onto the surface of the base portion of the wafer so that a portion of the masking material is suspended over the bevel;
- applying a first conductive layer of material onto the surface of the wafer, including over all of the bevel formed into the wafer;
- and
- applying a second conductive layer of material onto the first conductive layer.
Dependencies are inferred from the claim text.