Method of manufacturing packages, bonded wafer member, piezoelectric vibrator, oscillator, electronic apparatus, and radio timepiece
AssigneeSII Crystal Technology Inc.
InventorJunya Fukuda
Life of this patent
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Abstract
A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.
Claims9
A method of manufacturing packages having contents sealed therein, comprising:
- a step of forming cavities in a plurality of package forming areas on a first wafer;
- a step of bonding the first wafer and a second wafer while arranging the contents in the cavities;
- and
- a step of irradiating a bonded wafer member bonded to each other with a laser and separating the packages into pieces,
- characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.
A bonded wafer member including cavities having contents sealed therein in a plurality of package forming areas of a first wafer and a second wafer bonded to each other,
- characterized in that dummy cavities are formed on an outside of the package forming areas in an outermost periphery.
Dependencies are inferred from the claim text.