Adaptively Tracking Spectrum Features For Endpoint Detection
AssigneeApplied Materials, Inc.
InventorsJeffrey Drue David, Dominic J. Benvegnu, Boguslaw A. Swedek, Harry Q. Lee
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Abstract
A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
Claims20
A method of controlling polishing, comprising:
- polishing a substrate;
- monitoring a substrate during polishing with an in-situ monitoring system;
- generating a sequence of values from measurements from the in-situ monitoring system;
- fitting a non-linear function to the sequence of values;
- determining a projected time at which the non-linear function reaches a target value;
- and
- determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
A method of controlling polishing, comprising:
- polishing a substrate;
- measuring a sequence of spectra of light from the substrate during polishing;
- generating a sequence of values, including for each measured spectrum of the sequence of spectra, determining a wavelength or width of a peak or valley of a spectra feature;
- fitting a non-linear function to the sequence of values;
- determining a projected time at which the non-linear function reaches a target value;
- and
- determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
Dependencies are inferred from the claim text.