Structure and method for thin film device with stranded conductor

A method of forming at least one TFD with stranded conductor, comprising:

• providing a substrate;
• providing a plurality of parallel spaced electrically conductive strips upon the substrate;
• depositing a plurality thin film device layer upon the conductive strips;
• providing a 3D structure upon the thin film device layers, the 3D structure having a plurality of different heights, at least one first height defining a portion of the conductive strips to be severed, at least one second height defining a portion of the conductive strips to be bundled;
• etching the 3D structure and thin film device layers to define a TFD disposed above a portion of the conductive strips aligned to a second height and adjacent to a first height;
• severing the conductive strips defined by the first height;
• and
• bundling the portion of conductive strips defined by the second height.