Level posture sensing chip and its manufacturing method, level posture sensor
AssigneeBeijing Information Technology Institute
InventorFuxue Zhang
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Abstract
The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes: a semiconductor substrate; two sets of arm thermosensitive fuses formed on the surface of the semiconductor substrate, each set of the thermosensitive fuses including two thermosensitive fuses in parallel to each other, the two sets of thermosensitive fuses being vertical to each other; electrodes formed at the two ends of the thermosensitive fuses. For the level posture sensing chip and sensor provided by the present invention, the parallelism and verticality of the thermosensitive fuses is high in precision such that the more accurate measurement can be implemented.
Claims7
A semiconductor chip manufacturing method, comprising the steps of:
- forming a mask layer on a surface of a semiconductor substrate;
- forming thermosensitive fuses and a heating fuse on the mask layer;
- forming electrodes at the ends of the thermosensitive fuses and the heating fuse;
- and
- forming an arm by etching the area of the semiconductor substrate where the thermosensitive fuses and the heating fuse are.
Dependencies are inferred from the claim text.