Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsReza Argenty Pagaila, Byung Tai Do, Jong-Woo Ha
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and the outer interconnect.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base circuit assembly having an integrated circuit device;
- mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device;
- applying an encapsulant over the inner interconnect and the outer interconnect;
- and
- removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and the outer interconnect.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base circuit assembly having an integrated circuit device and a bottom substrate;
- mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device;
- applying an encapsulant over the base circuit assembly, the inner interconnect, and the outer interconnect;
- and
- removing a portion of the pre-formed conductive frame exposing an inner exposed contact surface of the inner interconnect and an outer exposed contact surface of the outer interconnect.
An integrated circuit packaging system comprising:
- a base circuit assembly having an integrated circuit device;
- an outer interconnect;
- an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device;
- and
- an encapsulant applied over the inner interconnect and the outer interconnect and with the inner interconnect and the outer interconnect substantially exposed.
Dependencies are inferred from the claim text.