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US 2011/0256646 A1Published application
Method for manufacturing led package and substrate thereof
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorSHEN-BO LIN
Life of this patent
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Abstract
In a method for manufacturing a LED package, a substrate of the LED package is formed by thermally pressing at least one insulating plate over an electrode plate and then grinding the insulating plates to expose the electrode plate.
Claims15
A method for manufacturing a number of LED packages, comprising following steps:
- providing an electrode plate and at least one insulating plate, wherein the electrode plat comprises a number of electrode units, each of the electrode units having a first electrode and a second electrode;
- thermally pressing the electrode plate and the at least one insulating plate to have the first electrode and the second electrode wrapped by the at least one insulating plate;
- grinding two ends of the electrode plate to expose the first electrodes and the second electrodes for obtaining a substrate plate;
- disposing a plurality of LED chips on the substrate plate and electrically connecting the plurality of LED chips to the first electrodes and the second electrodes;
- and
- cutting the substrate plate to obtain the number of LED packages.
3 more elements
A method for manufacturing a substrate for manufacturing a plurality of LED packages, comprising following steps:
- providing an electrode plate and at least one insulating plate, wherein the electrode plat comprises a plurality of electrode units, each of the electrode units having a first electrode and a second electrode;
- thermal pressing the electrode plate and the at least one insulating plate to have the first electrode and the second electrode wrapped by the at least one insulating plate;
- grinding two ends of the electrode plate to expose the first electrodes and the second electrodes for obtaining the substrate plate.
Dependencies are inferred from the claim text.