Back to results
US 2011/0256361 A1Published application
Electronic device housing and method for making the same
AssigneesFIH (Hong Kong) Limited, Shenzhen Futaihong Precision Industry Co., Ltd.
InventorsQI-JIAN DU, CHWAN-HWA CHIANG
Life of this patent
Estimating the term…
Abstract
An electronic device housing is provided. The electronic device housing includes a substrate, a first metallic coating formed on the substrate, and a second metallic coating formed on a portion of the first metallic coating. The first and second metallic coatings are formed by vacuum sputtering or vacuum vapor deposition. The first and second metallic coatings are all non-conductive. A method for making the electronic device housing is also described there.
Claims20
An electronic device housing, comprising:
- a substrate;
- a first metallic coating formed on the substrate by vacuum sputtering or vacuum vapor deposition;
- and
- a second metallic coating formed on a portion surface of the first metallic coating by vacuum sputtering or vacuum vapor deposition.
1 more element
A method for making electronic device housing, comprising:
- providing a substrate;
- vacuum sputtering or vacuum vapor depositing a first metallic coating on the substrate;
- providing a mask having a cut out pattern;
- covering the mask on the first metallic coating;
- vacuum sputtering or vacuum vapor depositing a metallic coating on the mask and the cut out pattern;
- and
- removing the mask to form a second metallic coating on the first metallic coating.
4 more elements
Dependencies are inferred from the claim text.