Glass substrate for semiconductor device component and process for producing glass substrate for semiconductor device component
AssigneeAsahi Glass Company, Limited
InventorsMotoshi ONO, Akio KOIKE
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Abstract
It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10×10−7 to 50×10−7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.
Claims13
A glass substrate having an average thermal expansion coefficient of from 10×10−7 to 50×10−7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.
A glass substrate for a semiconductor device component, which is a glass plate having a thickness of from 0.01 to 5 mm, an SiO2 content of from 50 to 70 mass % and an average thermal expansion coefficient of from 10×10−7 to 50×10−7/K within a range of from 50° C. to 300° C., wherein the glass plate has plural through-holes with a taper angle of from 0.1 to 20°.
A process for producing a glass substrate for a semiconductor device component, which comprises passing excimer laser light emitted from an excimer laser light-emitting device through a mask having plural through-holes and having the image of the mask reduction-projected by a projection lens, and irradiating a surface of a plate glass substrate having a thickness of from 0.01 to 5 mm, an SiO2 content of from 50 to 70 mass % and an average thermal expansion coefficient of from 10×10−7/K to 50×10−7/K within a range of from 50° C. to 300° C. with the reduction-projected excimer laser light so as to form through-holes corresponding to the through-holes of the mask in the plate glass substrate.
Dependencies are inferred from the claim text.