Electronic subassemblies for electronic devices

Apparatus, comprising:

• a radio-frequency shielding can having a first opening;
• an electrical component having a second opening that overlaps with the first opening;
• a mounting structure that is received in both the first and second openings;
• and
• a substrate to which the mounting structure mounts the radio-frequency shielding can and the electrical component.

Apparatus, comprising:

• a heat sink structure;
• a camera module mounted to the heat sink structure;
• and
• a flash unit mounted to the heat sink structure.

Shielded circuitry, comprising:

• a substrate;
• a plurality of electrical components mounted on the substrate;
• a radio-frequency shield that is attached to the substrate and that covers the plurality of electrical components, wherein a cavity is formed between an inner surface of the radio-frequency shield and the electrical components and portions of the substrate;
• and
• thermally conductive filler that substantially fills the cavity.