Multiple LED Bulb With Thermal Management Features
AssigneeInternational Development LLC
InventorChi Gon Chen
Life of this patent
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Abstract
An LED bulb assembly device having thermal management features. The device and methods for its manufacture are provided. The device consists of a machined base element that accepts a circuit board, a divider element, a heatsink element, and an LED assembly. The LED assembly includes a plurality of LEDs, but typically nine or eighteen. A reflector element encloses the internal components by positively engaging the base element. External electrical contact pins provide for electrical engagement with a compatible decorative lighting fixture.
Claims15
A multiple LED bulb device with thermal management features, the LED bulb device for installation in a decorative lighting fixture, the device comprising:
- an LED assembly including a plurality of LEDs affixed to a rigid mounting base such that all like-polarity LED leads are in electrical communication;
- a heatsink element made from a heat conductive material and including an inner receiving cavity for receiving the LED assembly, wherein the heatsink element is in thermal contact with the LED assembly;
- a circuit board element containing power conditioning circuitry for providing appropriate electrical power to the LED assembly, the circuit element including a rigid circuit board;
- a divider element for maintaining physical separation between the heatsink element and the circuit board element;
- an electrically conductive bridging device for supplying appropriately polarized power to the LED assembly from the circuit board element;
- a base element made from a rigid material and including an inner receiving cavity for receiving the circuit board element, the divider element, and the heatsink element;
- at least two electrical contact pins in electrical contact with the circuit board element;
- and
- a reflector element including a defined retention feature for engaging a suitable mating feature on the base element.
A method of manufacturing a multiple LED bulb device with thermal management features, the LED bulb device for installation in a decorative lighting fixture, the method steps comprising:
- providing an LED assembly that includes a plurality of LEDs affixed to a rigid mounting base such that all like-polarity LED leads are in electrical communication;
- providing a heatsink element made from a heat conductive material and including an inner surface for accepting the LED assembly;
- providing a divider element;
- providing a circuit element capable of providing appropriate electrical power to drive the LEDs of the LED assembly;
- providing an electrically conductive bridging device for supplying appropriately polarized power to the LED assembly from the circuit element;
- providing a base element made from a rigid material and including an inner surface for accepting the circuit element, the divider element, and the heatsink element;
- providing at least two contact pins in electrical contact with the circuit element, the pins for mating with a lighting fixture socket;
- and
- providing a reflector element including defined retention features for engaging the foundation element and reflective facets for influencing the pattern of light emanating from the energized LEDs.
A method of manufacturing a multiple LED bulb device with thermal management features, the LED bulb device for installation in a decorative lighting fixture, the method steps comprising:
- installing a circuit board element containing LED power conditioning circuitry within the inner receiving cavity of a base element;
- installing a divider element within the inner receiving cavity of the base element such that the divider element contacts the circuit board element surface opposite the side in contact with the base element;
- installing an LED assembly within the inner receiving cavity of a heatsink element such that the LED assembly is in thermal contact with the heatsink element;
- installing the heatsink element within the inner receiving cavity of the base element such that the divider element is in contact with the surface of the heatsink element opposite that of the heatsink element receiving cavity;
- connecting the circuit board element to the LED assembly such that the circuit board element circuitry is in electrical continuity with the LED assembly;
- installing two electrical contact pins in the base element such that the contact pins protrude beyond the bottom surface of the base element, wherein the contact pins are in electrical continuity with the circuit board element LED power conditioning circuitry;
- and
- installing a reflector element over the heatsink element such that defined retention features in the reflector element positively engage suitable mating features on the base element for positive retention of the reflector element and enclosure of the LED bulb device.
Dependencies are inferred from the claim text.