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US 2011/0255251 A1Published application
Electronic package and display apparatus
AssigneeSharp Kabushiki Kaisha
InventorKohei Kitagawa
Life of this patent
Estimating the term…
Abstract
Two bezels (BZ1, BZ2) which constitute a housing unit (UT) comprise a FPC board (PB1) for a panel and an FPC board (PB2) for an LED. The FPC hoard (PB1) for a panel and the FPC board (PB2) for an LED are connected to each other through a solder (11). An exposure opening (HL) through which the solder (11) is exposed from the inside of the housing unit (UT) to the outside thereof is formed in the portion (e.g., the rear bezel (BZ2)) of the housing unit (UT) that is located in front of the solder (11).
Claims4
An electronic package, comprising:
- a first circuit board;
- a second circuit board;
- and
- a housing unit that houses both the circuit boards,
- wherein conduction is established between the first circuit board and the second circuit board via an electrically conductive adhesive, and
- an exposure hole through which the electrically conductive adhesive is exposed from an inside of the housing unit to an outside thereof is formed at a part of the housing unit, which is positioned in front of the electrically conductive adhesive.
3 more elements
Dependencies are inferred from the claim text.