Loading patent…
AssigneeDanfoss Silicon Power GmbH
InventorsRonald Eisele, Mathias Kock, Teoman Senyildiz
Estimating the term…
Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps: manufacturing a one-piece lead frame; populating the lead frame with semiconductor devices, possible passive components, and bonding corresponding connections, inserting the thus populated lead frame into a compression mould so that accessibility of part areas of the lead frame is ensured, pressing a thermosetting compression moulding compound into the mould while enclosing the populated lead frame, coating the underside of the thus populated lead frame by thermal spraying in at least the electrically conducting areas and overlapping also the predominant areas of the spaces, filled with mold compound.
A rigid power module with a layer that insulates electrically and conducts well thermally and has been deposited as a coating, the layer comprising particles of aluminum oxide thermally sprayed onto the underside of the lead frame, the particles being fused to each other and to the lead frame in at least the electrically conducting areas of the lead frame and extending also over the majority of the area of the spaces between the electrically conducting areas that are filled with mould compound, wherein the layer of aluminum oxide together with a further metal layer of Al or Ag exhibits a firmly bonded connection to a cooling body.
A rigid power module with a layer that insulates electrically and conducts well thermally and has been deposited as a coating, the layer comprising particles of silicon carbide thermally sprayed onto the underside of the lead frame, the particles being fused to each other and to the lead frame in at least the electrically conducting areas of the lead frame and extending also over the majority of the area of the spaces between the electrically conducting areas that are filled with mould compound, wherein the carbidic, electrically insulating layer exhibits a thermal conductivity of 24 W/mK and is provided with a thermal-conduction paste that permanently remains in the residual gaps and capillaries for creep-resistant positive connection to a cooling body.
Dependencies are inferred from the claim text.