Silicon interposer for mems scalable printing modules
AssigneeXerox Corporation
InventorsPeter J. NYSTROM, Donald J. DRAKE
Life of this patent
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Abstract
A print module and a method of forming the same, the print module including a substrate, an ink jet die, and an interposer between the substrate and the ink jet die. The substrate includes an ink channel and an air vent, and the die includes a plurality of ink apertures. The interposer includes etched openings therein of a truncated pyramid shape; the openings of the interposer reconfiguring the ink channel and air vent passages between the substrate and die to allow for greater tolerance in alignment and manufacture of the print head module.
Claims20
A print module comprising:
- a substrate, the substrate comprising an ink channel and an air vent;
- an ink jet die mounted on the substrate, the die comprising a plurality of ink apertures;
- and
- an interposer positioned between the substrate and die, the interposer comprising etched openings, the interposer defining reconfigured ink channel and air vent passages between the substrate and die.
A method of forming a printer module, the method comprising:
- etching an interposer wafer to define passages therethrough;
- adhering an interposer wafer to a MEMS wafer;
- dicing the adhered interposer wafer and MEMS wafer into a plurality of ink jet die;
- and
- mounting the ink jet die to a substrate.
A method of forming a print head, the method comprising:
- etching an interposer wafer to define passages therethrough;
- dicing the interposer wafer to form a plurality of interposer die;
- adhering an interposer die to a MEMS die, wherein the interposer die comprises a larger footprint than the MEMS die;
- and
- adhering the interposer die to a substrate.
Dependencies are inferred from the claim text.