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US 2011/0254577 A1Published application
Non-Reflow Probe Card Structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorYung-Hsin Kuo
Life of this patent
Estimating the term…
Abstract
In accordance with an embodiment, a probe card structure comprises a base board, a connection interposer over the base board, a substrate over the connection interposer, and a fixture over the substrate securing the substrate and the connection interposer to the base board. The connection interposer comprises interposer electrodes that provide an electrical connection between electrodes on the base board and first electrodes on the substrate.
Claims20
A probe card structure comprising:
- a base board;
- a connection interposer over the base board;
- a substrate over the connection interposer, wherein the connection interposer comprises interposer electrodes that provide an electrical connection between electrodes on the base board and first electrodes on the substrate;
- and
- a fixture over the substrate securing the substrate and the connection interposer to the base board.
2 more elements
A probe card structure comprising:
- a connection interposer disposed over a base board, wherein the connection interposer comprises a bottom surface adjoining the base board and an opposite top surface, and wherein the connection interposer comprises electrodes extending from the bottom surface to the top surface;
- a substrate disposed over the connection interposer, wherein the substrate adjoins the top surface of the connection interposer, the substrate having electrodes corresponding to respective electrodes of the connection interposer;
- and
- a fixture disposed over the substrate and along a periphery of the substrate, wherein the fixture secures the substrate and the connection interposer to the base board.
1 more element
A method comprising:
- providing a base board;
- providing a connection interposer over the base board;
- providing a substrate over the connection interposer, wherein the connection interposer provides an electrical connection between the base board and the substrate;
- securing the substrate and the connection interposer to the base board by providing a fixture over the connection interposer and secured to the base board;
- and
- securing a test head to the base board.
3 more elements
Dependencies are inferred from the claim text.