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US 2011/0254574 A1Published application
Prober, testing apparatus, and method of inspecting semiconductor chip
AssigneeFujitsu Semiconductor Limited
InventorKazuhiro Tashiro
Life of this patent
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Abstract
A prober includes a probe card provided with a support board and a probe attached to the support board, a stage on which a measurement wafer is mounted, a camera provided over the probe card to observe an electrode pad of a first semiconductor chip formed on the measurement wafer, and a stage moving unit for moving the position of the stage relative to the probe card.
Claims19
A prober comprising:
- a probe card including a support board and a probe attached to the support board;
- a stage on which a measurement wafer is mounted;
- a camera provided over the probe card to observe an electrode pad of a first semiconductor chip formed on the measurement wafer;
- and
- moving units for moving a position of the stage relative to the probe card.
2 more elements
A testing apparatus comprising:
- a tester unit;
- and
- a prober unit electrically connected to the tester unit, wherein
- the prober unit includes:
- a probe card provided with a support board and a probe attached to the support board;
- a stage on which a measurement wafer is mounted;
- a camera provided over the probe card to observe an electrode pad of a semiconductor chip formed on the measurement wafer;
- and
- moving units for moving a position of the stage relative to the probe card.
6 more elements
A method of inspecting a semiconductor chip, comprising:
- bringing a probe attached to a support board of a probe card into contact with an electrode pad of the first semiconductor chip formed on a measurement wafer on a stage, and measuring electrical characteristics of a first semiconductor chip, wherein
- before or after the first semiconductor chip is measured, the electrode pad of the first semiconductor chip is observed with a camera provided over the support board or above the probe card.
Dependencies are inferred from the claim text.