Semiconductor module and motorized equipment using the same
AssigneeDenso Corporation
InventorHideki MINATO
Life of this patent
Estimating the term…
Abstract
In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.
Claims14
A semiconductor module comprising:
- a semiconductor chip for switching energization of a winding related to drive of a motor;
- a wiring board that is mounted with the semiconductor chip and that has an energization route routed through the semiconductor chip;
- a mold section that is formed from a resin in the shape of a plate such that the semiconductor chip and the wiring board are embedded in the mold section;
- a winding connection terminal extending from the wiring board to an outside of the mold section, the winding connection terminal being connected with the winding;
- a control terminal extending from the wiring board to the outside of the mold section, the control terminal being connected with a control board that controls the energization of the winding;
- and
- a plurality of lands provided on a side of the wiring board opposite to the semiconductor chip, the lands having radiation surfaces exposed from the mold section and being capable of dissipating a heat, which is generated by the semiconductor chip, by establishing surface-to-surface contact between the radiation surfaces and a radiation member, wherein
- the lands constitute a land row, in which the radiation surfaces are arranged on the same plane and on a straight line.
A semiconductor module comprising:
- a semiconductor chip for switching energization of a winding related to drive of a motor;
- a wiring board that is mounted with the semiconductor chip and that has an energization route routed through the semiconductor chip;
- a mold section that is formed from a resin in the shape of a plate such that the semiconductor chip and the wiring board are embedded in the mold section;
- a winding connection terminal extending from the wiring board to an outside of the mold section, the winding connection terminal being connected with the winding;
- a control terminal extending from the wiring board to the outside of the mold section, the control terminal being connected with a control board that controls the energization of the winding;
- and
- a plurality of lands provided on a side of the wiring board opposite to the semiconductor chip, the lands having radiation surfaces exposed from the mold section and being capable of dissipating a heat, which is generated by the semiconductor chip, by establishing surface-to-surface contact between the radiation surfaces and a radiation member, wherein
- the lands constitute a land row, in which the radiation surfaces are arranged on the same plane and on an arc.
Dependencies are inferred from the claim text.