Grounded chuck
AssigneeLam Research Corporation
InventorsMichael BRUGGER, Otto LACH
Life of this patent
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Abstract
Improved reduction of static charge in spin chucks is achieved by providing one or more pin assemblies which are formed from chemically inert material and which include an electrically conductive inlay.
Claims15
Device for processing wafer-shaped articles, comprising a chuck adapted to maintain a wafer-shaped article in a predetermined orientation during a processing operation to be performed on the article, said chuck comprising a chuck body and a plurality of pin assemblies adapted and positioned relative to the chuck body so as to support a wafer-shaped article to be processed, wherein at least one of said pin assemblies is formed from a chemically inert material and includes an electrically conductive inlay at one end, said inlay being adapted to physically and electrically engage a bearing element.
A structure for use in devices for processing wafer-shaped articles, comprising a pin assembly, wherein said pin assembly is formed from a chemically inert material and includes an electrically conductive inlay at one end.
Pin assembly for use in a device for processing wafer-shaped articles, wherein said pin assembly is formed from a chemically inert conductive polymer material and includes an electrically conductive inlay at one end.
Dependencies are inferred from the claim text.