Back to results
US 2011/0254176 A1Published application
Dicing tape-integrated film for semiconductor back surface
AssigneeNitto Denko Corporation
InventorsNaohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI, Akiyoshi YAMAMOTO, Tomokazu TAKAHASHI
Life of this patent
Estimating the term…
Abstract
The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
Claims10
A dicing tape-integrated film for semiconductor back surface comprising:
- a dicing tape comprising a base material and a pressure-sensitive adhesive layer on the base material;
- and
- a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer,
- wherein at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
1 more element
Dependencies are inferred from the claim text.