Stack package having flexible conductors
AssigneeHynix Semiconductor Inc.
InventorsTae Min KANG, You Kyung HWANG, Jae-hyun SON, Dae Woong LEE, Byoung Do LEE, Yu Hwan KIM
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Abstract
A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.
Claims20
A stack package comprising:
- a first package including a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip;
- a second package stacked on the first package, and including a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip;
- and
- flexible conductors disposed in the first encapsulation member of the first package so as to electrically connect the first package and the second package.
A stack package comprising:
- a first package comprising:
- a first substrate having an upper surface on which first bond fingers and connection pads are disposed and having a lower surface on which first ball lands are disposed;
- a first semiconductor chip disposed on the upper surface of the first substrate and having first bonding pads which are electrically connected with the first bond fingers;
- and
- a first encapsulation member formed on the upper surface of the first substrate so as to seal the first semiconductor chip;
- a second package stacked on the first package, the second package comprising:
- a second substrate having an upper surface on which second bond fingers are disposed and a lower surface on which second ball lands are disposed;
- a second semiconductor chip disposed on the upper surface of the second substrate and having second bonding pads which are electrically connected with the second bond fingers;
- and
- a second encapsulation member formed on the upper surface of the second substrate so as to seal the second semiconductor chip;
- and
- flexible conductors disposed in the first encapsulation member of the first package so as to electrically connect the first package and the second package.
A stack package comprising:
- a first package including a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip;
- one or more second packages stacked on the first package, each of the one or more second packages including second semiconductor chips and second encapsulation members which seal the second semiconductor chips;
- and
- flexible conductors respectively disposed in the first encapsulation member of the first package and disposed in each of the second encapsulation members of the second packages excluding an uppermost second package among the one or more stacked second packages, so as to electrically connect the first package and the second packages with each other.
Dependencies are inferred from the claim text.