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US 2011/0254161 A1Published application
Integrated Circuit Package Having Under-Bump Metallization
AssigneeDyi Chung Hu
InventorDyi-Chung Hu
Life of this patent
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Abstract
An integrated circuit (IC) device uses a simple structure having X/Cu/Sn metal layers (X can be Ti or Ti/W etc.) without extra barrier layer. Thus, number of layers is reduced for a simple fabrication with good production and low cost.
Claims8
An integrated circuit (IC) device using under bump metallization (UBM), comprising:
- a semiconductor device,
- wherein said semiconductor device has a plurality of aluminum pads on a surface of said semiconductor device;
- wherein said semiconductor device is covered with a passivation layer on said surface of said semiconductor device;
- wherein said passivation layer has a plurality of first openings at a plurality of positions corresponding to said aluminum pads to partially disclose said aluminum pads;
- wherein a first dielectric layer is obtained on said passivation layer and said first dielectric layer has a plurality of second openings to disclose at least a part of said aluminum pads;
- wherein a metal layer of trace metal is obtained on said first dielectric layer and said metal layer has a plurality of metal pads to be correspondingly electrically connected with said aluminum pads through said second openings of said first dielectric layer;
- wherein a second dielectric layer is obtained on said first dielectric layer and said metal layer;
- and
- wherein said second dielectric layer has a plurality of third openings to correspondingly disclose said metal pads;
- a UBM layer, comprising
- an adhesion layer;
- a conductor layer;
- and
- a protection layer,
- wherein said UBM layer is obtained on said metal pads disclosed in said third openings of said semiconductor device;
- wherein said UBM layer covers a part of said second dielectric layer around said third openings;
- wherein said adhesion layer is obtained on said metal pads and said part of said second dielectric layer to be adhered with a substrate and said metal layer;
- wherein said conductor layer is obtained on said adhesion layer;
- and
- wherein said protection layer is obtained on said conductor layer to provide a surface having solder-ability and to prevent said conductor layer from oxidation;
- and
- a solder bump,
- wherein said solder bump is obtained on said protection layer of said UBM layer.
20 more elements
Dependencies are inferred from the claim text.