Wafer Level Die Integration and Method Therefor

A method of making a semiconductor device, comprising:

• providing a carrier;
• forming a first interconnect structure over the carrier;
• forming a plurality of conductive pillars over the first interconnect structure opposite the carrier;
• mounting a semiconductor die to the first interconnect structure between the conductive pillars;
• depositing an encapsulant over the semiconductor die and first interconnect structure and around the conductive pillars;
• and
• forming a second interconnect structure over the semiconductor die and conductive pillars.

A method of manufacturing a semiconductor device, comprising:

• forming a first interconnect structure;
• forming a plurality of conductive pillars over the first interconnect structure;
• mounting a semiconductor die to the first interconnect structure between the conductive pillars;
• and
• depositing an encapsulant over the semiconductor die and first interconnect structure and around the conductive pillars.

A semiconductor device, comprising:

• a first interconnect structure;
• a plurality of conductive pillars formed over the first interconnect structure;
• a semiconductor die mounted to the first interconnect structure between the conductive pillars;
• and
• an encapsulant deposited over the semiconductor die and first interconnect structure and around the conductive pillars.