Die structure and die connecting method
AssigneeRaydium Semiconductor Corporation
InventorsChia-Hung Hsu, Ching-San Lin, Chin-Yung Chen
Life of this patent
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Abstract
A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block.
Claims13
A die structure for electrically coupling to a circuit board, comprising:
- a die;
- a bump structure, including:
- a body disposed on the die;
- and
- a solder layer disposed on the body.
A die connecting method, comprising:
- providing a die structure, wherein the die structure includes:
- a die;
- and
- a bump structure including a body disposed on the die and a solder layer disposed on the body;
- providing a circuit board, wherein the circuit board includes:
- a plate;
- a circuit disposed in the plate;
- a copper block disposed on the plate and coupling to the circuit;
- and
- a tin layer disposed on the copper block;
- and
- soldering the solder layer of the die structure with the tin layer on the copper block of the circuit board structure.
A die connecting method, comprising:
- providing a die structure, wherein the die structure includes:
- a die;
- and
- a bump structure including a body disposed on the die and a solder layer disposed on the body;
- providing a circuit board, wherein the circuit board includes:
- a plate;
- a circuit disposed in the plate;
- and
- a copper block disposed on the plate and coupling to the circuit;
- and
- soldering the solder layer of the die structure on a surface of the copper block of the circuit board.
Dependencies are inferred from the claim text.