Semiconductor component and manufacturing method of semiconductor component

A semiconductor component, comprising:

• a semiconductor element that includes a plurality of signals;
• a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element to the outside;
• a heat conduction member that dissipates heat generated by the semiconductor element;
• a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element;
• a support member formed with an opening so as to surround the semiconductor element that is provided with a plurality of depressions in an upper face and supports the heat conduction member;
• a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board;
• and
• a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.