US 2011/0254148 A1 · SEMICONDUCTOR APPARATUS

Abstract

The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.

Claims20

Dependent claims

A semiconductor apparatus, comprising:

a semiconductor device of a surface mount package type and a wiring member both attached to a heat sink,
wherein a fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device in the fitting portion provided to the wiring member.

Dependencies are inferred from the claim text.

Facts

Application

12/908,500Filed 20 Oct 2010

Priority

JP 2010-09392515 Apr 2010

Published

20 Oct 2011

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 1/021
Cooling of mounted components: components thermally connected to metal substrates or heat-sinks by insert mounting
H10W 40/10
Arrangements for thermal protection or thermal control: arrangements for heating
H10W 40/641
Securing means for detachable heating or cooling arrangements, e.g. clamps: snap-on arrangements, e.g. clips
H10W 70/68
Characterised by their insulating layers or insulating parts: shapes or dispositions thereof

Semiconductor apparatus

Life of this patent

Semiconductor apparatus

Life of this patent

Abstract

Claims20