Semiconductor equipment and method of manufacturing the same

A semiconductor equipment comprising:

• a sealed container;
• a stem connected to said sealed container via a stem peripheral portion;
• and
• a semiconductor device mounted on a top surface of said stem, inside said sealed container,
• wherein said semiconductor device is electrically connected to a lead provided to said stem,
• said stem peripheral portion is bonded along a periphery of said stem, said stem peripheral portion being made of a material that is different from a material of said stem and the same as a material of said sealed container,
• said stem peripheral portion and said sealed container are connected by welding,
• said sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether,
• said lead is placed inside a lead hole formed in said stem,
• said lead has a smaller diameter at a bottom-side of said stem than at a top-side of said stem, and
• said lead hole has a smaller diameter at a bottom-side of said stem than at a top-side of said stem.

A semiconductor equipment comprising:

• a sealed container;
• a stem connected to said sealed container via a stem peripheral portion;
• and
• a semiconductor device mounted on a top surface of said stem, inside said sealed container,
• wherein said semiconductor device is electrically connected to a lead provided to said stem,
• said stem peripheral portion is bonded along a periphery of said stem, said stem peripheral portion being made of a material that is different from a material of said stem and the same as a material of said sealed container,
• said stem peripheral portion and said sealed container are connected by welding,
• said sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether, and
• when pressure inside said sealed container is represented by P (MPa) and volume by V (m3), a value of P×V is equal to or less than 0.004.

A method of manufacturing a semiconductor equipment, said method comprising:

• brazing a stem peripheral portion onto a stem, the stem peripheral portion being made of a material that is different from a material of the stem;
• forming a lead hole in the stem;
• placing a lead inside the lead hole, filling a gap between the lead hole and the lead with a ceramic having a same thermal expansion coefficient as the stem and the lead, and baking the ceramic;
• mounting a semiconductor device onto a top surface of the stem;
• bonding the semiconductor device and the lead using bonding wire or a ribbon;
• connecting a sealed container to the stem peripheral portion by welding, the sealed container being made of a same material as the stem peripheral portion;
• creating a vacuum inside the sealed container by evacuating air via an air evacuation pipe provided in the sealed container;
• injecting a working fluid into the sealed container, in a vacuum state;
• and
• sealing the air evacuation pipe,
• wherein the sealed container is filled with the working fluid which includes at least one of ethanol, a perfluorocarbon, and a fluoroether.