Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

A leadframe for a microelectronic device, comprising:

• a die paddle disposed longitudinally between first and second ends of the leadframe and disposed latitudinally between first and second sides of the leadframe;
• a first lead defining a first portion of the die paddle and extending generally longitudinally between the first and second ends of the leadframe;
• a second lead defining a second portion of the die paddle and having a first section and a second section, the first section of the second lead extending generally longitudinally from the first end, and the second section of the second lead extending generally laterally between the first side and the first section of the second lead;
• a third lead defining a third portion of the die paddle and having a first section and a second section, the first section of the third lead extending generally longitudinally from the first end, and the second section of the third lead extending generally laterally between the second side and the first section of the third lead.

A method of manufacturing a leadframe for a microelectronic device, the leadframe extending longitudinally between first and second ends and latitudinally between first and second sides, comprising:

• forming a first lead extending generally longitudinally between the first and second ends of the leadframe;
• forming a second lead including—
• forming a first section of the second lead, the first section of the second lead extending generally longitudinally from the second end of the leadframe;
• and
• forming a second section of the second lead, the second section of the second lead extending laterally between the first side of the leadframe and the first section of the second lead;
• and
• forming a third lead including—
• forming a first section of the third lead, the first section of the third lead extending generally longitudinally from the second end of the leadframe;
• and
• forming a second section of the third lead, the second section of the third lead extending laterally between the second side of the leadframe and the first section of the third lead.

A method of manufacturing a leadframe for a microelectronic device, the leadframe extending longitudinally between first and second ends and latitudinally between first and second sides, comprising:

• forming a first dambar proximate to the first end;
• forming a second dambar proximate to the second end, the second dambar being spaced a first distance from the first dambar;
• forming a first tie-bar connecting the first and second dambars;
• forming a second tie-bar connecting the first and second dambars, the second tie-bar being spaced a second distance from the first tie-bar;
• and
• forming a plurality of leads, including—
• forming a first lead extending generally longitudinally from the first dambar to the second dambar;
• and
• forming a second lead extending longitudinally from the first dambar to a first intermediate location and laterally between the first tie-bar and the first intermediate location;