Memory cell with carbon switching material having a reduced cross-sectional area and methods for forming the same
AssigneeSanDisk 3D LLC
InventorsFranz Kreupl, Er-Xuan Ping, Jingyan Zhang, Huiwen Xu
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AssigneeSanDisk 3D LLC
InventorsFranz Kreupl, Er-Xuan Ping, Jingyan Zhang, Huiwen Xu
Estimating the term…
In a first aspect, a method of forming a metal-insulator-metal (“MIM”) stack is provided, the method including: (1) forming a dielectric material having an opening and a first conductive carbon layer within the opening; (2) forming a spacer in the opening; (3) forming a carbon-based switching material on a sidewall of the spacer; and (4) forming a second conductive carbon layer above the carbon-based switching material. A ratio of a cross sectional area of the opening in the dielectric material to a cross sectional area of the carbon-based switching material on the sidewall of the spacer is at least 5. Numerous other aspects are provided.
A method of forming a metal-insulator-metal (“MIM”) stack, the method comprising:
A method of forming a metal-insulator-metal (“MIM”) stack, the method comprising:
A method of forming a memory cell, the method comprising:
A method of forming a memory cell, the method comprising:
A metal-insulator-metal (“MIM”) stack comprising:
A memory cell comprising:
Dependencies are inferred from the claim text.