US 2011/0254047 A1Published application

Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, And Optical Semiconductor Device

AssigneeDow Corning Toray Co., Ltd.

InventorsMakoto Yoshitake, Takashi Sagawa, Masayoshi Terada

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Abstract

A hydrosilylation reaction-curable organopolysiloxane composition comprising (A) a methylpheny-lalkenylpolysiloxane that has at least two alkenyl groups wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, (B) a methylphenylhydrogenpolysiloxane that has at least two Si-bonded hydrogen atoms wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole 1% is comprised of phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor element sealant comprising this composition. An optical semiconductor device sealed with this optical semiconductor element sealant.

Claims18

Dependent claims

A hydrosilylation reaction-curable organopolysiloxane composition comprising

(A) a methylphenylalkenylpolysiloxane that has at least two silicon-bonded alkenyl groups per molecule, wherein diphenylsiloxane units are no more than 5 mole% of the total siloxane units and phenyl groups are at least 20 mole% of the total silicon-bonded organic groups in the molecule,
(B) a methylphenylhydrogenpolysiloxane that has at least two silicon-bonded hydrogen atoms per molecule, wherein diphenylsiloxane units are no more than 5 mole% of the total siloxane units and phenyl groups are at least 20 mole% of the total silicon-bonded organic groups in the molecule, and
(C) a hydrosilylation reaction catalyst, wherein the diphenylsiloxane units are no more than 5 mole% of the total siloxane units in this composition.

Dependencies are inferred from the claim text.

Facts

Application: 13/126,440Filed 30 Oct 2009
Priority: JP 2008-28124331 Oct 2008
Published: 20 Oct 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10W 74/476
Comprising organic materials, e.g. plastics or resins: organic materials comprising silicon
C08L 83/04
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with…
C08G 77/12
Polysiloxanes: containing silicon bound to hydrogen
C08G 77/20
Polysiloxanes: containing silicon bound to unsaturated aliphatic groups