Liquid reflector
AssigneePerkinelmer Elcos GmbH
InventorsAndreas Ahlisch, Frank Gindele, Siegmund Kobilke
Life of this patent
Estimating the term…
Abstract
A light emitting diode (LED) package is disclosed which has an integral reflector for improving performance. The package includes a substrate for supporting the LED. A frame is formed on the top surface of the substrate surrounding the LED. During fabrication, a liquid compound is dispensed into the frame in a manner to surround the LED without covering the active area of the LED. The liquid compound includes particles for scattering light. The top surface of the liquid compound is curved due to surface tension. The curvature remains after the compound is cured. In a preferred embodiment, an encapsulating material is used to cover the LED and the compound. The reflector functions to increase the light output from the LED package.
Claims21
A light emitting package comprising:
- a light emitting chip;
- a substrate supporting the light emitting chip;
- a frame positioned on the top surface of the substrate, wherein the light emitting chip is surrounded by the frame;
- and
- a reflector material covering a portion of the substrate lying between the frame and the light emitting chip, the reflector material surrounding the light emitting chip without covering the active area of the light emitting chip, the reflector material having an curved top surface, the reflector material being formed from a compound which is initially in liquid form and is thereafter cured to a solid form, and wherein the compound includes a plurality of particles for scattering light.
A light emitting package comprising:
- a light emitting chip;
- a substrate supporting the light emitting chip;
- a frame positioned on the top surface of the substrate, wherein the light emitting chip is surrounded by the frame;
- a reflector material covering a portion of the substrate lying between the frame and the light emitting chip, the reflector material surrounding the light emitting chip without covering the active area of the light emitting chip, the reflector material having an curved top surface, the reflector material being formed from a compound which is initially in liquid form and is thereafter cured to a solid form, and wherein the compound includes a plurality of particles for scattering light;
- and
- a transparent plate placed on top of the frame and covering the light emitting chip.
A method of fabricating a light emitting diode (LED) package of the type having an LED chip attached to the top surface of a substrate, comprising the steps of:
- forming a frame on the top surface of the substrate, the frame surrounding the LED chip;
- dispensing a compound in liquid form within and bounded by the frame in a manner to surround the LED chip without covering the active area of the LED chip, said compound including particles for scattering light;
- curing the compound to define a reflector element having a curved top reflective surface;
- dispensing an encapsulating material to cover the LED chip and the curved top reflective surface;
- and
- curing the encapsulating material.
A light emitting package comprising:
- a light emitting chip;
- a substrate supporting the light emitting chip;
- a frame positioned on the top surface of the substrate, wherein the light emitting chip is surrounded by the frame;
- a material covering a portion of the substrate lying between the frame and the light emitting chip, the reflector material surrounding the light emitting chip without covering the active area of the light emitting chip, the material having an curved top surface, the reflector material being formed from a compound which is initially in liquid form and is thereafter cured to a solid form;
- and
- an encapsulation covering the light emitting chip, wherein a scattering interface is formed between the curved top surface of the material and the bottom surface of the encapsulation.
A method of fabricating a light emitting diode (LED) package of the type having an LED chip attached to the top surface of a substrate, comprising the steps of:
- forming a frame on the top surface of the substrate, the frame surrounding the LED chip;
- dispensing a compound in liquid form within and bounded by the frame in a manner to surround the LED chip without covering the active area of the LED chip,
- curing the compound to define an element having a curved top surface;
- dispensing an encapsulating material to cover the LED chip and the curved top surface;
- and
- curing the encapsulating material wherein a scattering interface is formed between the curved top surface of the material and the bottom surface of the encapsulation.
Dependencies are inferred from the claim text.