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US 2011/0254028 A1Published application
Light Emitting Diode
AssigneesEverlight Electronics Co., Ltd., Everlight Yi-Guang Technology (Shanghai) Ltd.
InventorChien-Chang PEI
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Abstract
The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip.
Claims20
A light emitting diode, comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- at least one light emitting diode chip disposed on the first surface of the substrate;
- and
- a plurality of thermal metal pads disposed on the second surface of the substrate, the thermal metal pads electrically isolated from the at least one light emitting diode chip.
1 more element
A light emitting diode, comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- at least one light emitting diode chip disposed on the first surface of the substrate;
- a first conductive trace metal layer and a second conductive trace metal layer disposed on the first surface of the substrate and electrically connected to the at least one light emitting diode chip;
- and
- a plurality of thermal metal pads disposed on the second surface of the substrate, the thermal metal pads electrically isolated from each other.
2 more elements
Dependencies are inferred from the claim text.