Surface mounted led package
AssigneeLite-On Technology Corporation
InventorsCHIH-LUNG LIANG, YUAN-FU CHEN
Life of this patent
Estimating the term…
Abstract
An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively.
Claims16
An LED device, comprising:
- a lead frame with a first plane and a second plane opposite to the first plane;
- a reflection cup structure disposed on the lead frame;
- a LED chip disposed on the first plane of the lead frame, wherein the LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame;
- a lens structure, made of thermoplastic transparent material corresponding to the LED chip, covering the reflection cup structure and the lead frame;
- and
- at least one fixing structure, made of thermoplastic transparent material and formed integrally with the lens structure, wherein the fixing structure is formed at a side of one of the reflection cup structure and the lead frame to retain at least one of the reflection cup structure and the lens structure fixedly to the lead frame.
An LED module comprising:
- a lead frame;
- a plurality of reflection cup structures disposed on a first plane of the lead frame, two adjacent reflection cup structures being disposed at a specific distance on the lead frame;
- a plurality of LED chips disposed in the plurality of reflection cup structures respectively and electrically connected to the lead frame;
- a plurality of lens structures formed above the plurality of LED chips respectively;
- and
- a plurality of fixing structures associated with the lead frame for fixing the plurality of lens structures on at least one of the reflection cup structures and the lead frame,
- wherein the plurality of fixing structures and the plurality of lens structures are made of a thermoplastic transparent material.
Dependencies are inferred from the claim text.